IRL530NSTRLPBF: HEXFET Power MOSFET Datasheet and Application Circuit Analysis

Release date:2025-10-29 Number of clicks:132

IRL530NSTRLPBF: HEXFET Power MOSFET Datasheet and Application Circuit Analysis

The IRL530NSTRLPBF is a renowned N-channel HEXFET Power MOSFET from Infineon Technologies, celebrated for its robust performance in power switching applications. This device leverages advanced processing to achieve low on-state resistance and high switching speed, making it a preferred choice for designers of power supplies, motor controllers, and DC-DC converters.

A thorough analysis of its datasheet reveals key specifications that define its operational boundaries. The transistor is characterized by a drain-to-source voltage (VDSS) of 100V and a continuous drain current (ID) of 14A at a case temperature of 25°C. A standout feature is its exceptionally low gate-drive requirement, facilitated by its logic-level gate threshold voltage (VGS(th)). Typically as low as 1.0V, this allows the MOSFET to be fully enhanced by low-voltage control circuits (e.g., 3.3V or 5V microcontrollers), eliminating the need for a gate driver IC in many scenarios. Furthermore, its maximum on-state resistance (RDS(on)) is a mere 0.16Ω at VGS = 4V, which directly translates to high efficiency and lower power dissipation in the form of heat.

A fundamental application circuit for the IRL530NSTRLPBF is a low-side switch, commonly used to control loads like motors or lamps. In this configuration:

1. The load is connected between the positive supply (VDD) and the drain of the MOSFET.

2. The source terminal is connected directly to ground.

3. A gate resistor (e.g., 10Ω to 100Ω) is connected between the output of a microcontroller (MCU) and the MOSFET's gate. This resistor damps high-frequency oscillations and limits inrush current during switching.

4. A pull-down resistor (e.g., 10kΩ) from the gate to ground is critical to ensure the MOSFET turns off reliably by discharging the gate capacitance when the MCU output is in a high-impedance state.

For optimal performance, careful PCB layout is paramount. Minimizing the length and loop area of the high-current switched path (drain to source) is essential to reduce parasitic inductance, which can cause voltage spikes and electromagnetic interference (EMI). While the device has built-in avalanche ruggedness, in highly inductive load circuits, an external flyback diode or a snubber network may be required to protect the MOSFET from voltage transients exceeding its VDSS rating.

ICGOOODFIND: The IRL530NSTRLPBF is an exceptionally versatile power MOSFET, offering a compelling combination of logic-level control, low on-resistance, and high current handling. Its robustness and ease of use make it an excellent component for a wide array of medium-power switching applications, from hobbyist projects to industrial designs.

Keywords: Logic-Level Gate, Low On-Resistance, Power Switching, Low-Side Switch, HEXFET MOSFET.

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